Ensenso C | CR Series Colored 3D vision

Die 3D-Kameras der Ensenso C/CR-Serie in drei unterschiedlichen Größen

200 W projector power

Depth accuracy

Compact dimensions

Industrial grade

IP65/67 protection

Color sensor

Onboard processing

The next step for 3D cameras

Without compromise, the new C series combines all Ensenso advantages in the 3D vision environment. Digital twins can finally also distinguish color. Despite simplified handling and a more compact design, voluminous applications benefit from higher reproducible Z-accuracy and more light output from the projector electronics. And the more uniform housings of the available model variants also enable a higher cost efficiency in the 3D upper class. The new CR models with integrated depth calculation even produce high-resolution 3D data directly within the camera, significantly reducing the computing load - for maximum efficiency with minimum network load.

Readymade models

Immediately applicable at any working distance

Several model variants with alternative baselines (distance between the stereo cameras), focal lengths and focus distances are available for diverse application scenarios. This ensures optimum Z-accuracy for 3D capture in different working distances.

S models deliver high precision at short working distances. M and L models, with a longer baseline, cover large working volumes with high accuracy from greater distances.

The coordinate systems of the stereo and RGB cameras are fully calibrated against each other. In addition, all lenses, including the pattern projector, are factory preset to the field of view and working distance of the respective model, thus facilitating handling and commissioning.

Fully integrated RGB sensor

Color vision is not a privilege, but a desirable quality

The additional RGB sensor generates texture data that supplements the 3D point cloud with true color information, thus ensuring realistic 3D images. This makes it easier to distinguish colored objects for subsequent processes.

Compact and robust

Fully enclosed housing without corners and edges

With its extremely compact design (depth: 100 mm, height: 58 mm: length S: 290 mm, length M: 506 mm, length L: 900 mm), all internal components of the C/CR series are optimally protected against all external influences in accordance with IP65/67 and are resistant to vibrations and shocks. The integrated electronics and housing design simplify cabling and therefore also allow reliable operation in challenging environments, such as use on a robot arm.

Cabling effort minimized

Single-cable operation for simple, space-saving 3D integration

The compact housing of the Ensenso C and CR series is supported by a simple connection design: A screwable Gigabit Ethernet connector with PoE++ (IEEE 802.3bt, up to 90 W) enables single-cable operation for data and power. Alternatively, an external 24 V DC power supply can be used to utilize the full projector power, for example. Additional GPIO signals are available for direct control of flash and trigger - ideal for simple, space-saving integration in industrial applications.

200 watt projector

High 3D resolution even in difficult situations

The new optimized design of the C-/CR-Series enables highly efficient operation of the projector electronics with up to 200 watt power. This results in exceptionally high luminosity of the FlexView3 Pattern, improving pattern contrast on objects even at long distances.

Z-noise < 0.1 mm

Reproducibly precise even at long distance

Thanks to their large baseline (850 mm), the L models achieve a reproducible Z-accuracy of around 0.4 mm even at an object distance of 3.5 m, which is only a half of the pixel image at this distance. The optimized housing design minimizes temperature-related deviations of the depth values to a minimum (e.g.: 0.075 mm deviation at 30 cm distance and 10°C temperature change).

Grafische Darstellung der Tiefenberechnung bei der 3D-Kamera Ensenso C

Oncamera depth calculation

3D results reduce the volume of data

The Ensenso CR series combines the features of the C series with the advantages of an embedded system. A system-on-chip processes up to 16 high-resolution image pairs from the two 2D stereo sensors in the camera, providing high-resolution 3D data at a high frame rate directly as a result. By shifting the computationally intensive depth calculations to the camera, no powerful industrial PCs are required to perform these tasks. In addition, the transfer of 3D result data instead of high-resolution 2D raw data reduces the network traffic load. Multi-camera systems in particular benefit from those resource-saving features of the CR series.

Detailed view of SMD-assembled electronic modules side by side

3D data with high detail sharpness enable presence checks of smallest objects (~1 mm), such as SMD components on electronic assemblies.

One camera, many applications

Detect & recognize

Automated spatial detection and gripping of moving objects increases productivity in many applications. The high-luminance projector also ensures high pattern contrast for singleshot images, resulting in detailed, robust 3D data for object handling.

Bin picking

The capabilities of the applied 3D camera impact the robot's ability to successfully detect, pick and place parts. The Ensenso C extends these capabilities with the integrated RGB sensor for color-dependent applications.

De-palletizing

Automated palletizing of arbitrary packages and goods is still a challenge in logistics applications. The Ensenso C enables reliable detection of object size, rotation and actual position even with different and densely stacked goods, even from a great distance.

Test & measuring

Contactless measurement and inspection of quality parameters in large-volume applications from greater object distances requires high reproducible 3D resolution. Large baselines and a powerful pattern projector ensure optimal feature recognition in millimeter range even at working distances up to 5 m.

Examples from practice

Plan your project

Ensenso SDK

Cameras of the Ensenso C camera family are easy to set up and operate via the Ensenso SDK. In addition to wizards for easy setup and camera calibration support for the 3D cameras, it also includes GPU-based image processing for even faster 3D data processing.

  • One software package (Ensenso SDK for Windows and Linux) for all Ensenso models
  • MVTec HALCON, C, C++ and C# sample programs with source code
  • Output of a single 3D point cloud with data from all cameras used in multi-camera mode
  • Live composition of the 3D point clouds from multiple viewing directions
  • Robot hand-eye calibration
  • Integration of uEye industrial cameras, for example, to capture additional colour information or barcodes

Ensenso 3D operation

How does AI laser dot triangulation work?

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FlexView technology

Moving or stationary objects?

FlexView technology

Applications

Automate with 3D vision

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What customers say about Ensenso C 3D cameras:

“High projector performance and resolution together with fast data processing were our main technical criteria when selecting the camera. The installation in a fixed housing was also an advantage.”

— Andreas Redekop, VMT Project Manager and Technology Manager —