IDS case study: Wired with micrometer precision
2D cameras for positioning and inspecting ultra-fine wires in semiconductor production
Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometers are used to create tiny electrical connections between a semiconductor chip and other components. The distances between the bond wires are often less than 100 micrometers.
Any deviation, however small, can lead to connection errors. Wire bonding therefore requires the highest precision and forms the basis for the production of high-performance electronics, which are used in many different applications. F&S BONDTEC Semiconductor GmbH from Braunau, Austria, relies on image processing technology with industrial cameras from IDS.
