IDS case study: See. Align. Place.
Precision vision systems power Micro-LED bonding and HBM packaging
In advanced electronics manufacturing, every micron counts. That’s why Micraft Systems Plus, a technology pioneer from Taiwan, relies on high-performance USB3 industrial cameras from the uEye CP series for two of its flagship systems – for MicroLED and High Bandwidth Memory (HBM) applications.
The uLED Laser Soldering Machine integrates two U3-3800CP cameras to align and bond thousands of MicroLEDs onto large-area substrates with sub-micron precision and real-time rotation correction. Post-transfer, the same cameras assist with in-line visual inspection to ensure placement quality.
Similarly, the HBM High-Accuracy Die Bonder uses two U3-3890CP cameras to enable exact die-to-substrate alignment and placement in stacked memory modules – where even the slightest misalignment can impact thermal or electrical performance.
Both systems are already deployed in high-volume production across Asia. Their precision, scalability, and long-term stability make them equally relevant for global markets pursuing advanced 2.5D/3D packaging and MicroLED integration.
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